Technique

Classics in software engineering by Edward Yourdon

By Edward Yourdon

An outstanding selection of very good articles on software program engineering via luminaries like Dijkstra, Knuth, Wirth, Parnas, Boehm, and others. a real vintage ebook on software program engineering edited via Edward Yourdon. a must have for each software program engineer.

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D. Resistance between the tip of soldering systems and the workstation common point ground should not exceed 5 ohms. Heated element and tips are measured when at their normal operating temperature. Note: Current limiting soldering equipment manufactured to EN 00015-1:1992 may not meet this requirement. e. AC and DC current leakage from heated tip to ground should not create deleterious effects on equipment/ components. f. Tip transient voltages generated by the soldering equipment should not exceed 2V peak (Zin ≥ Ω).

Applies to all classes. 4 Hardware found to be manufactured with nonconforming materials or processes. Applies to class 3 only. 2 Terminals modified to accept oversize conductors. 3 Gold not removed as required. 4 Lead nicks or damage to components beyond the allowance. 4b Lead bend does not meet distance/radius requirement. 5 Insulation and Wire Damage 5a 7a 8 36 Class Class Class 1 2 3 Charred insulation or damage to wire in excess of that allowed. 6 D D D 7b Adhesive material visible in SMT termination area.

Properly wetted fillet shall be evident. The maximum fillet may overhang the land or extend onto the top of the end cap metallization; however, the solder shall not extend further onto the component body. 1 2 3 4 7 6 8 5 9 Figure 9-5 1. 2. 3. 4. 5. 24 Rectangular or Square End Components Side overhang End overhang End joint width See Note 4, Table 9-5 Side joint length, end overlap 6. One or two face termination 7. Three face termination 8. Five face termination 9. , MELF) Solder joints to components having cylindrical end cap terminations shall1 meet the dimensional and solder fillet requirements of Table 9-6 and Figure 9-6 for each product classification.

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